Course Syllabus E E 396K 26-MICROELECTROMECHANICAL SYS unique # 15690

The "official" class syllabus can be found here: link to pdf of final course syllabus, Jan. 2005.

MICRO-ELECTROMECHANICAL SYSTEMS (MEMS): FABRICATION AND DEVICE APPLICATIONS

Spring, 2005; M-W 8:00 – 9:30, ENS 126 Instructor: Dean P. Neikirk, office: ENS 634, phone 471-4669; MER 1.606C, 1-8549

e-mail: neikirk@mail.utexas.edu
Office Hours: M-W 9:30-10:30; otherwise by appointment (see my office schedule at http://weewave.mer.utexas.edu/DPN_files/office_class_hours.html)
Class Web Page: http://weewave.mer.utexas.edu/DPN_files/courses/Mems/mems_class.htm
On-Line Lecture Notes: http://weewave.mer.utexas.edu/DPN_files/courses/Mems/lecture_notes/396_lecture_list.htm
On-Line Homework assignments: http://weewave.mer.utexas.edu/DPN_files/courses/Mems/homework/homework_list.htm

Objectives: This is the third time this class has been offered here at UT-Austin. At this moment I am still adding to the class notes from 2002. The overall objective of this class is simple: what good are “micro-machines”? We will begin with an overview of some of the processing techniques commonly used for MEMS fabrication. These techniques are usually adapted from IC processing: we will discuss basic materials, some mechanical properties, then concentrate on deposition, lithography, and etch (wet and dry). We will then discuss applications of MEMS technology to actuation and sensing. I will try to use some “case studies” to investigate the utility of MEMS devices. We will most likely look at temperature, pressure, acceleration, RF, optical, and chemical applications.

Class Projects: You must complete a class project, which will count for 40% of your grade. The project will consist of the identification of a MEMS device/system that is actually used in a commercial product, and a detailed, critical examination of the product development history to identify why/if a MEMS devices actually improved the performance of this system. This will include a search of the patent literature to help identify the unique features of the product. You will then prepare a written term paper on your findings (thoroughly referenced!!), as well as giving a DETAILED oral presentation (about 20 minutes) to the class. Before making your class presentation expect to spend at least two hours with me, with a return visit to clarify any problems (and I guarantee I will find something to object to) identified in your first meeting with me. Class presentations will begin in early to mid-April.

Here is a link to some of the papers that students did in Spring 2002 (look below the list of my lectures to see the list of student talks).

Reference texts:

• Gregory Kovacs, Micromachined Transducers Sourcebook. Boston: McGraw-Hill, 1998, ISBN 0-07-290722-3.
• S. M. Sze, "Semiconductor Sensors," John Wiley & Sons, Inc., 1994
• Ljubisa Ristic, "Sensor Technology and Devices," Artech House, 1994
• Julian W. Gardner, "Microsensors - Principles and Applications," John Wiley & Sons, Inc., 1994
• Richard S. Muller et al., "Microsensors," IEEE PRESS 1991
• William S. Trimmer, "Micromechanics and MEMS - classic and seminal papers to 1990," IEEE PRESS 1996(?)
• N. Maluf, An Introduction to Microelectromechanical Systems Engineering. Norwood, MA: Artech House, 2000.
• M. Tabib-Azar, Microactuators: Electrical, Magnetic,Thermal, Optical, Mechanical, Chemical, and Smart Structures: Kluwer, 1998, ISBN 0792380894.
• M. Koch, A. Evans, and A. Brunnschweiler, Microfluidic Technology and Applications: Research Studies Press, Ltd., 2000, ISBN 0863802443.

Grades Your grades will be based upon performance on homework, exams, and the class project. Homework will be assigned approximately weekly; credit for late homework will be reduced at a rate of 10% per class the work is late.

The weighting for different areas is:

• Homework 20%
• Midterm project review 20%
• Class project 40%
• Final 20% 100%

The worst-case grades will be based on: A: 100-90% of total points available; B: 80-89%; C: 70-79%; D: 55-70%; F: 0-55%

Lecture Schedule 2005 (subject to revision as we go along...):

Lecture	Date	Date
1	1/19				
2	1/24	Intro to mems: actuator and sensor examples			
3	1/26	Material properties: thermal; mechanical properties			
4	1/31	Cantilever beams 			
5	2/2	Dynamic mechanical response			
6	2/7	Force mechanisms: electrostatic, thermal			
7	2/9	Basic materials: silicon, impurities, defects			
8	2/14	Thin film growth and deposition			
9	2/16	Thin film growth and deposition			
10	2/21	Lithography			
11	2/23	Etching 			
12	2/28	Bulk and RIE anisotropic etching			
13	3/2	Deep RIE, CMP, “Special” mems processes (plating, bonding, etc.)			
14	3 /7 	Strain & pressure sensors			
15	3 /9	Case study: Fabry-Perot pressure sensor			
	3/14-3/18	SPRING BREAK			
16	3/21	Case study: design of F-P sensor for yield 			
17	3/23	Case study: accelerometers			
18	3/28	Case study: bolometers for electromagnetic detection			
19	3/30	thermal losses in bolometers; fabrication; performance			
20	4/4	chemical sensors: gas/vapor phase			
21	4/6	chemical sensors: liquid phase			
22	4/11				
23	4/13				
24	4/18	Student presentations: 			
25	4/20	Student presentations:			
26	4/25	Student presentations:			
27	4/27	Student presentations:			
28	5/2	Student presentations:			
29	5/4	Student presentations:			

	FINAL: Friday, May 13, 9:00-12:00 

Links and resources for MEMS related information:

Also see my other list of reference materials .

Return to the Microelectromagnetics Devices Group .

Refs list for chemical sensors .