For further information contact Professor Dean Neikirk
at
neikirk@mail.utexas.edu
Interconnect and transmission line
modeling summary.
Interconnect
Series Impedance Determination Using a Surface Ribbon Method
Emre Tuncer, Beom-Taek Lee, Sangwoo Kim, and Dean P. Neikirk
Department of Electrical and Computer Engineering
University of Texas at Austin
Austin, Texas 78712
Most of the slides shown here were presented at the IEEE
3rd Topical Meeting on Electrical Performance of Electronic Packaging (EPEP),
Monterey, CA, Nov. 2-4, 1994; the work is summarized in the paper above,
and also in our EPEP 94 Proceedings paper:
- E. Tuncer, Beom-Taek Lee, and D. P. Neikirk, "Interconnect Series
Impedance Determination Using a Surface Ribbon Method" IEEE 3rd Topical
Meeting on Electrical Performance of Electronic Packaging, Monterey, CA,
Nov. 2-4, 1994, pp. 250-252.
The accuracy of the ribbon technique using a minimum numbers of ribbons
is discussed in our presentation at EPEP 96:
- B.-T. Lee and D. P. Neikirk, "Minimum Segmentation in the Surface
Ribbon Method for Series Impedance Calculations of Microstrip Lines,"
IEEE 5th Topical Meeting on Electrical Performance of Electronic Packaging,
Napa, CA, October 28-30, 1996.
The accuracy for "twin lead" using minimum ribbons shown below
was calculated by Sangwoo Kim in our group.
Efficiency can be improved even further by minimizing
the number of ribbons used.