Links take you to the OPs you need to read before lab!!!

Week of

Lab

Topic

Sept 9

1

Intro to Safety and Facilities

Sept. 16

2

Group A:

oxide thickness;

Group B:

1st PR: diffusion; etching

3

1st PR: diffusion; etching

oxide thickness

Sept. 17-18

Catch-up lab; must be ready for lab 4

Sept. 19-21

Batch process: Process Step 5; Furnace Pre-deps: Boron, Phosphorus

Sept. 23

4

etch; 4-pt probe

Sept. 24-25

Catch up lab; must be ready for lab 5

Sept. 26-Sept. 29

Batch process: Process Step 7a; Drive-in

Sept. 30

5

Group A:

oxide thickness; etch; 4-pt probe

Group B:

2nd PR: gate mask; etching

Oct. 7

6

2nd PR: gate mask; etching

oxide thickness; etch; 4-pt probe

Oct. 8-9

Catch up lab: must be ready for lab 7

Oct. 10-12

Batch process: Process Step 11; Gate-ox

Oct. 24

LAB REPORT I DUE Friday Oct. 24 IN LECTURE!

Oct. 14

7

Group A:

oxide thickness; junction depth

Group B:

3rd PR: contact windows

Oct. 21

8

3rd PR: contact windows

oxide thickness; junction depth

Oct. 28

9

etch windows; front side evap.; 4th PR

Nov. 4

10

front side Al evap., 4th PR cont.; Al etch; backside Al evaporation

Nov. 11

11

4th PR, Al etch cont., backside evap cont.; Al anneals

Nov. 12-13

Catch up lab: must have device fab complete

Nov. 17

LAB REPORT II DUE Friday Nov. 21 IN LECTURE!!

Nov. 18

12

Electrical Testing:  YOU ARE ONLY RESPONSIBLE FOR PERFORMING THE MEASUREMENTS IN THE TROUBLE SHOOTING PROCEDURE

Nov. 25

13

Electrical Testing

Dec. 2

14

Electrical Testing

Dec. 5

FINAL LAB REPORT III DUE FRIDAY